- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
Patent holdings for IPC class H01L 23/46
Total number of patents in this class: 372
10-year publication summary
|
15
|
20
|
33
|
32
|
37
|
56
|
30
|
42
|
42
|
21
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| International Business Machines Corporation | 60644 |
21 |
| Intel Corporation | 45621 |
21 |
| Frore Systems Inc. | 75 |
18 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
16 |
| Denso Corporation | 23338 |
12 |
| Fuji Electric Co., Ltd. | 4750 |
12 |
| Raytheon Company | 8535 |
10 |
| Siemens AG | 24990 |
5 |
| Toyota Motor Corporation | 28582 |
5 |
| Micron Technology, Inc. | 24960 |
5 |
| Mitsubishi Electric Corporation | 43934 |
5 |
| Google LLC | 38759 |
5 |
| Infineon Technologies AG | 8189 |
4 |
| Hyundai Motor Company | 19021 |
4 |
| Danfoss Silicon Power GmbH | 163 |
4 |
| Delta Design, Inc. | 55 |
4 |
| Kia Corporation | 6450 |
4 |
| Samsung Electronics Co., Ltd. | 131630 |
3 |
| Amogreentech Co., Ltd. | 566 |
3 |
| National University of Singapore | 2228 |
3 |
| Other owners | 208 |